Wafer-level packaged MEMS switch with TSV
dc.contributor.author | Lietaer, Nicolas | |
dc.contributor.author | Bakke, Thor | |
dc.contributor.author | Summanwar, Anand | |
dc.contributor.author | Dalsjø, Per G. | |
dc.contributor.author | Gakkestad, Jakob | |
dc.contributor.author | Niklaus, Frank | |
dc.date.accessioned | 2017-02-20T10:55:10Z | |
dc.date.available | 2017-02-20T10:55:10Z | |
dc.date.created | 2011-12-22T09:37:10Z | |
dc.date.issued | 2011 | |
dc.identifier.citation | International Wafer-Level Packaging Conference | nb_NO |
dc.identifier.uri | http://hdl.handle.net/11250/2431338 | |
dc.language.iso | eng | nb_NO |
dc.title | Wafer-level packaged MEMS switch with TSV | nb_NO |
dc.type | Lecture | nb_NO |
dc.identifier.cristin | 871935 | |
cristin.unitcode | 7401,90,31,0 | |
cristin.unitname | Mikrosystemer og nanoteknologi | |
cristin.ispublished | true | |
cristin.fulltext | postprint |
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