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dc.contributor.authorSchjølberg-Henriksen, Kari
dc.date.accessioned2017-02-08T12:38:12Z
dc.date.available2017-02-08T12:38:12Z
dc.date.created2015-09-24T19:59:57Z
dc.date.issued2009
dc.identifier.urihttp://hdl.handle.net/11250/2430004
dc.description.abstract* 3D integration: Opportunities and trends* e-CUBES: Tire pressure monitoring system (TPMS)* Package design including thermo-mechanical modeling* Technology development* Sensor packaging concept* Gold stud bump bonding* Device characterization and testing* Summary and outlook
dc.description.abstract3D Integration of MEMS and IC: Design, technology and simulations
dc.language.isoengnb_NO
dc.title3D Integration of MEMS and IC: Design, technology and simulationsnb_NO
dc.typeLecturenb_NO
dc.identifier.cristin1271649
cristin.unitcode7401,90,31,0
cristin.unitnameMikrosystemer og nanoteknologi
cristin.ispublishedtrue
cristin.fulltextpostprint


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