dc.contributor.author | Schjølberg-Henriksen, Kari | |
dc.date.accessioned | 2017-02-08T12:38:12Z | |
dc.date.available | 2017-02-08T12:38:12Z | |
dc.date.created | 2015-09-24T19:59:57Z | |
dc.date.issued | 2009 | |
dc.identifier.uri | http://hdl.handle.net/11250/2430004 | |
dc.description.abstract | * 3D integration: Opportunities and trends* e-CUBES: Tire pressure monitoring system (TPMS)* Package design including thermo-mechanical modeling* Technology development* Sensor packaging concept* Gold stud bump bonding* Device characterization and testing* Summary and outlook | |
dc.description.abstract | 3D Integration of MEMS and IC: Design, technology and simulations | |
dc.language.iso | eng | nb_NO |
dc.title | 3D Integration of MEMS and IC: Design, technology and simulations | nb_NO |
dc.type | Lecture | nb_NO |
dc.identifier.cristin | 1271649 | |
cristin.unitcode | 7401,90,31,0 | |
cristin.unitname | Mikrosystemer og nanoteknologi | |
cristin.ispublished | true | |
cristin.fulltext | postprint | |