3D Integration of MEMS and IC: Design, technology and simulations
Lecture
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http://hdl.handle.net/11250/2430004Issue date
2009Metadata
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Abstract
* 3D integration: Opportunities and trends* e-CUBES: Tire pressure monitoring system (TPMS)* Package design including thermo-mechanical modeling* Technology development* Sensor packaging concept* Gold stud bump bonding* Device characterization and testing* Summary and outlook 3D Integration of MEMS and IC: Design, technology and simulations