dc.contributor.author | Cheng, Canhua | |
dc.contributor.author | Yang, Zhenjing | |
dc.date.accessioned | 2022-01-31T16:00:24Z | |
dc.date.available | 2022-01-31T16:00:24Z | |
dc.date.issued | 2021 | |
dc.identifier.isbn | 978-82-536-1728-2 | |
dc.identifier.issn | 2387-4295 | |
dc.identifier.uri | https://hdl.handle.net/11250/2976109 | |
dc.description.abstract | Rapid development of cities has led to the shortage of land for residents' activities, while rational use of the space under urban viaducts can effectively alleviate this problem. The thermal environment of the space under the viaduct is a key factor that affects human comfort during activities. In this paper, the thermal comfort under the Egongyan Bridge in Chongqing was evaluated by winter thermal environment test, thermal sensational voting (TSV) and universal thermal climate index (UTCI). It was found that the sky view factor (SVF) had a stronger linear correlation with UTCI than the spatial height width ratio (H/B). Furthermore, pedestrians pay attention to environmental thermal parameters mainly in the aspect of sunshine. This study provides a reference for the thermal environment optimization of the space under viaducts in the future, and provides a basis for the sustainable development of the city. | |
dc.language.iso | eng | |
dc.publisher | SINTEF Academic Press | |
dc.relation.ispartof | Healthy Buildings 2021 – Europe. Proceedings of the 17th International Healthy Buildings Conference 21–23 June 2021 | |
dc.relation.ispartof | | |
dc.relation.ispartofseries | SINTEF Proceedings;9 | |
dc.rights | CC BY 4.0 | |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | |
dc.title | Research on Thermal Comfort of Activity Space under Viaduct in Mountain City —Take Chongqing Egongyan Bridge as an example | |
dc.type | Chapter | |
dc.type | Peer reviewed | |
dc.type | Conference object | |
dc.description.version | publishedVersion | |
dc.rights.holder | © 2021 The Authors. Published by SINTEF Academic Press. | |
dc.subject.nsi | VDP::Teknologi: 500 | |