Molecular Dynamics Simulation of Heat Transfer at Contact Interface of Hot Forming Die

dc.contributor.author	Lu, Baoshan
dc.contributor.author	Wang, Leigang
dc.contributor.author	Ma, Xiang
dc.date.accessioned	2020-11-24T08:17:08Z
dc.date.available	2020-11-24T08:17:08Z
dc.date.created	2020-02-05T15:39:46Z
dc.date.issued	2019
dc.identifier.issn	1757-8981
dc.identifier.uri	https://hdl.handle.net/11250/2689209
dc.language.iso	eng	en_US
dc.publisher	IOP Science	en_US
dc.rights	Navngivelse 4.0 Internasjonal	*
dc.rights.uri	http://creativecommons.org/licenses/by/4.0/deed.no	*
dc.title	Molecular Dynamics Simulation of Heat Transfer at Contact Interface of Hot Forming Die	en_US
dc.type	Peer reviewed	en_US
dc.type	Journal article	en_US
dc.description.version	publishedVersion	en_US
dc.rights.holder	Content from this work may be used under the terms of theCreative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltd	en_US
dc.source.pagenumber	6	en_US
dc.source.volume	627	en_US
dc.source.journal	IOP Conference Series: Materials Science and Engineering	en_US
dc.source.issue	1	en_US
dc.identifier.doi	10.1088/1757-899X/627/1/012024
dc.identifier.cristin	1791297
cristin.unitcode	7401,80,63,0
cristin.unitname	Metallproduksjon og prosessering
cristin.ispublished	true
cristin.fulltext	original
cristin.qualitycode	1

Except where otherwise noted, this item's license is described as Navngivelse 4.0 Internasjonal