Molecular Dynamics Simulation of Heat Transfer at Contact Interface of Hot Forming Die
Peer reviewed, Journal article
Published version
Date
2019Metadata
Show full item recordCollections
- Publikasjoner fra CRIStin - SINTEF AS [4353]
- SINTEF Industri [1109]
Original version
10.1088/1757-899X/627/1/012024Publisher
IOP ScienceJournal
IOP Conference Series: Materials Science and EngineeringCopyright
Content from this work may be used under the terms of theCreative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltd
Except where otherwise noted, this item's license is described as Navngivelse 4.0 Internasjonal