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dc.contributor.authorRebhan, Bernhard
dc.contributor.authorHinterreiter, Andreas
dc.contributor.authorMalik, Nishant
dc.contributor.authorSchjølberg-Henriksen, Kari
dc.contributor.authorDragoi, Viorel
dc.contributor.authorHingerl, Kurt
dc.date.accessioned2017-12-19T07:58:33Z
dc.date.available2017-12-19T07:58:33Z
dc.date.created2016-09-28T19:19:29Z
dc.date.issued2016
dc.identifier.citationECS Transactions. 2016, 75 (9), 15-24.nb_NO
dc.identifier.issn1938-5862
dc.identifier.urihttp://hdl.handle.net/11250/2472662
dc.description.abstractAluminum-aluminum thermo-compression wafer bonding is becoming increasingly important in the production of microelectromechanical systems (MEMS) devices. As the chemically highly stable aluminum oxide layer acts as a diffusion barrier between the two aluminum metallization layers, up to now the process has required bonding temperatures of 300°C or more. By using the EVG®580 ComBond® system, in which a surface treatment and subsequent wafer bonding are both performed in a high vacuum cluster, for the first time successful Al-Al wafer bonding was possible at a temperature of 100°C. The bonded interfaces of blank Al wafers and Al wafers with patterned frames were characterized using C-mode scanning acoustic microscopy (C-SAM) and transmission electron microscopy (TEM) as well as dicing yield and pull tests representative for the bonding strength. The investigations revealed areas of oxide-free, atomic contact at the Al-Al bonded interface.nb_NO
dc.language.isoengnb_NO
dc.titleLow-Temperature Aluminum-Aluminum Wafer Bondingnb_NO
dc.typeJournal articlenb_NO
dc.typePeer reviewednb_NO
dc.description.versionacceptedVersionnb_NO
dc.source.pagenumber15-24nb_NO
dc.source.volume75nb_NO
dc.source.journalECS Transactionsnb_NO
dc.source.issue9nb_NO
dc.identifier.doi10.1149/07509.0015ecst
dc.identifier.cristin1387162
dc.relation.projectNorges forskningsråd: 247781nb_NO
cristin.unitcode7401,90,31,0
cristin.unitnameMikrosystemer og nanoteknologi
cristin.ispublishedtrue
cristin.fulltextpostprint
cristin.qualitycode1


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