High Temperature Power Electronics Packaging
dc.contributor.author | Larsson, Andreas | |
dc.contributor.author | Tollefsen, Torleif Andre | |
dc.contributor.author | Storstrøm, Olav Barros | |
dc.contributor.author | Fallet, Truls | |
dc.date.accessioned | 2017-02-28T11:06:36Z | |
dc.date.available | 2017-02-28T11:06:36Z | |
dc.date.created | 2017-02-24T11:36:58Z | |
dc.date.issued | 2013 | |
dc.identifier.isbn | 9788214042788 | |
dc.identifier.uri | http://hdl.handle.net/11250/2432314 | |
dc.description.abstract | The lack of robust and reliable packaging methods are considered to be one of the main challenges for the next generation of high temperature electronics (>200 °C). Power electronics are especially difficult to operate in this environment. This project investigated packaging technologies suitable for a high temperature power module for operation up to 250 °C. The key technologies investigated were: • A novel type ceramic substrate active metal brazed (AMB) silicon nitride (Si3N4) showed no signs of degradation. • A state-of-the-art Au-Sn solid-liquid interdiffusion (SLID) die attach was developed. • Silicon carbide reinforced aluminium (AlSiC) with cold sprayed Cu was used as a base plate. • Different thermal interface materials were investigated. • Finally, a power module concept was developed. It was based on silicon carbide (SiC) bipolar transistors (BJT). The main conclusion drawn from this project is that reliable packaging technologies for 200 °C and beyond seem possible. Suitable packaging technologies are emerging but commercially available electronic components compatible with this temperature range and these novel technologies are still very sparse. Oppdragsgiver: Norwegian research council | |
dc.language.iso | eng | nb_NO |
dc.publisher | SINTEF | nb_NO |
dc.relation.ispartof | SINTEF Rapport | |
dc.relation.ispartofseries | SINTEF Rapport; | |
dc.title | High Temperature Power Electronics Packaging | nb_NO |
dc.type | Research report | nb_NO |
dc.source.pagenumber | 65 | nb_NO |
dc.source.issue | A23931 | nb_NO |
dc.identifier.cristin | 1453646 | |
dc.relation.project | Stiftelsen SINTEF: 191308/S60 | nb_NO |
cristin.unitcode | 7401,90,32,0 | |
cristin.unitname | Instrumentering | |
cristin.ispublished | true | |
cristin.fulltext | original |
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