Blar i SINTEF Open på forfatter "Moe, Sigurd T."
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A miniaturized pressure sensor with inherent biofouling protection designed for in vivo applications
Clausen, Ingelin; Moe, Sigurd T.; Tvedt, Lars Geir Whist; Vogl, Andreas; Wang, Dag Thorstein (Journal article; Peer reviewed, 2011)The design, fabrication, and measurement results for a diaphragm-based single crystal silicon sensor element of size 820 µm × 820 µm × 500 µm are presented. The sensor element is designed for in vivo applications with ... -
Al-Al Wafer-Level Thermocompression Bonding applied for MEMS
Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje (Chapter, 2017)Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are ... -
Conductivity of high-temperature annealed silicon direct wafer bonds
Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein (Journal article; Peer reviewed, 2015)Silicon direct wafer bonding is a process with many application areas. Depending on the application, perfect insulation or negligible resistance is desired across the bonded interface. We have investigated the resistivity ... -
Cost-effective processing of a piezoresistive MEMS cantilever sensor
Clausen, Ingelin; Moe, Sigurd T.; Vogl, Andreas (Chapter, 2011)In this paper cost-effective methods for fabrication of a piezoresistive cantilever sensor for industrial use are focused. The intended use of the presented cantilever is a medical application. A closer description of the ... -
Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin; Fournel, Frank; Moe, Sigurd T. (Journal article; Peer reviewed, 2015)The electrical, mechanical, and hermeticity properties of low-temperature, plasma activated direct silicon bonds were investigated. On individual dies with a bonding area ranging from 1–4 mm2, the bonded interface was found ... -
Fabrication of an array of silicon microscales for the monitoring of chemical processes
Lacolle, Matthieu Jean P; Johansen, Ib-Rune; Wang, Dag Thorstein; Moe, Sigurd T.; Sagberg, Håkon; Clausen, Sigmund; Karlsson, Arne; Akporiaye, Duncan (Journal article; Peer reviewed, 2012)We present the fabrication and demonstration of a two-dimensional array of scales micromachined in silicon. Each scale consists of a platform suspended by a spring. The mass present on the platform of each scale is measured ... -
Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks
Vereshchagina, Elizaveta; Poppe, Erik Utne; Schjølberg-Henriksen, Kari; Wöhrmann, Markus; Moe, Sigurd T. (Chapter, 2018)Thermo-mechanical stability of metal structures is one of the key factors affecting accuracy of micro-electromechanical (MEMS) piezoresistive pressure sensors. In this work, we present the measurement results of stress and ... -
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ... -
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ... -
Optical MEMS filter for infrared gas detection
Bakke, Thor; Lacolle, Matthieu Jean P; Sagberg, Håkon; Johansen, Ib-Rune; Moe, Sigurd T. (Lecture, 2008)An optical filter is proposed, which can be adapted to infrared detection of various gases. The filter is based on a diffraction grating structured on a micro-electro-mechanical system (MEMS) which can be switched between ... -
Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding
Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein (Journal article; Peer reviewed, 2016)The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity ... -
Through Silicon Vias in MEMS packaging, a review
Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian (Lecture, 2019)Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) ... -
Two-state Optical Filter Based on Micromechanical Diffractive Elements
Sagberg, Håkon; Bakke, Thor; Johansen, Ib-Rune; Lacolle, Matthieu Jean P; Moe, Sigurd T. (Chapter, 2007)We have designed a robust two-state filter for infrared gas measurement, where the filter transmittance alternates between a single bandpass function, and a double-band offset reference. The device consists of fixed and ... -
Wafer bonding process for zero level vacuum packaging of MEMS
Sordo, Guido; Collini, Cristian; Moe, Sigurd T.; Poppe, Erik Utne; Wright, Daniel Nilsen (Chapter; Peer reviewed, 2020)It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees ...