• English
    • norsk
  • English 
    • English
    • norsk
  • Login
View Item 
  •   Home
  • SINTEF
  • Publikasjoner fra CRIStin
  • Publikasjoner fra CRIStin - SINTEF AS
  • View Item
  •   Home
  • SINTEF
  • Publikasjoner fra CRIStin
  • Publikasjoner fra CRIStin - SINTEF AS
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

Non-destructive wafer-level bond defect identification by scanning acoustic microscopy

Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari
Journal article, Peer reviewed
Accepted version
Thumbnail
View/Open
SAM+paper+revised+v01.pdf (1.205Mb)
Permanent link
http://hdl.handle.net/11250/2483768
Issue date
2015
Metadata
Show full item record
Collections
  • SINTEF Digital [1308]
  • Publikasjoner fra CRIStin - SINTEF AS [2636]
Original version
Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems. 2015, 21 (7), 1385-1394.   10.1007/s00542-014-2328-z
Abstract
Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the application of scanning acoustic microscopy (SAM) for assessing the quality of metal thermocompression bonds, both by evaluating its capabilities of localizing areas of poor bonding, and by finding defects in the integrity of the bond seal. Wafer laminates containing a test vehicle of sealing frames with pre-defined defects in the bond metal layer were sealed by Au–Au and Al–Al thermocompression bonding. Employing SAM, an area of five chips of poor bonding was identified non-destructively on the Al–Al laminate. Line defects of width 3.6 µm and point defects of diameter 22.4 µm have also been identified by SAM. The dicing yield for sealing frames was above 96 % for all frames of widths 100–400 µm and for both bond metal systems. The average bond strength was 31.5 ± 11.9 MPa for Al–Al thermocompression bonds and 37.3 ± 9.7 MPa for Au–Au thermocompression bonds. Scanning acoustic microscopy operates non-destructively and proved to be an extremely useful tool complementing current state-of-the-art methods for bond quality assessment.
Journal
Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems

Contact Us

Privacy policy
Powered by DSpace software

Service from Unit
 

 

Browse this CollectionIssue DateAuthorsTitlesSubjectsDocument TypesJournalsBrowse ArchiveCommunities & CollectionsIssue DateAuthorsTitlesSubjectsDocument TypesJournals

My Account

Login

Statistics

View Usage Statistics

Contact Us

Privacy policy
Powered by DSpace software

Service from Unit