• A miniaturized pressure sensor with inherent biofouling protection designed for in vivo applications 

      Clausen, Ingelin; Moe, Sigurd T.; Tvedt, Lars Geir Whist; Vogl, Andreas; Wang, Dag Thorstein (Journal article; Peer reviewed, 2011)
      The design, fabrication, and measurement results for a diaphragm-based single crystal silicon sensor element of size 820 µm × 820 µm × 500 µm are presented. The sensor element is designed for in vivo applications with ...
    • Al-Al Wafer-Level Thermocompression Bonding applied for MEMS 

      Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje (Chapter, 2017)
      Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are ...
    • Conductivity of high-temperature annealed silicon direct wafer bonds 

      Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein (Journal article; Peer reviewed, 2015)
      Silicon direct wafer bonding is a process with many application areas. Depending on the application, perfect insulation or negligible resistance is desired across the bonded interface. We have investigated the resistivity ...
    • Cost-effective processing of a piezoresistive MEMS cantilever sensor 

      Clausen, Ingelin; Moe, Sigurd T.; Vogl, Andreas (Chapter, 2011)
      In this paper cost-effective methods for fabrication of a piezoresistive cantilever sensor for industrial use are focused. The intended use of the presented cantilever is a medical application. A closer description of the ...
    • Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints 

      Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin; Fournel, Frank; Moe, Sigurd T. (Journal article; Peer reviewed, 2015)
      The electrical, mechanical, and hermeticity properties of low-temperature, plasma activated direct silicon bonds were investigated. On individual dies with a bonding area ranging from 1–4 mm2, the bonded interface was found ...
    • Fabrication of an array of silicon microscales for the monitoring of chemical processes 

      Lacolle, Matthieu Jean P; Johansen, Ib-Rune; Wang, Dag Thorstein; Moe, Sigurd T.; Sagberg, Håkon; Clausen, Sigmund; Karlsson, Arne; Akporiaye, Duncan (Journal article; Peer reviewed, 2012)
      We present the fabrication and demonstration of a two-dimensional array of scales micromachined in silicon. Each scale consists of a platform suspended by a spring. The mass present on the platform of each scale is measured ...
    • Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks 

      Vereshchagina, Elizaveta; Poppe, Erik Utne; Schjølberg-Henriksen, Kari; Wöhrmann, Markus; Moe, Sigurd T. (Chapter, 2018)
      Thermo-mechanical stability of metal structures is one of the key factors affecting accuracy of micro-electromechanical (MEMS) piezoresistive pressure sensors. In this work, we present the measurement results of stress and ...
    • Non-destructive wafer-level bond defect identification by scanning acoustic microscopy 

      Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)
      Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ...
    • Non-destructive wafer-level bond defect identification by scanning acoustic microscopy 

      Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)
      Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ...
    • Optical MEMS filter for infrared gas detection 

      Bakke, Thor; Lacolle, Matthieu Jean P; Sagberg, Håkon; Johansen, Ib-Rune; Moe, Sigurd T. (Lecture, 2008)
      An optical filter is proposed, which can be adapted to infrared detection of various gases. The filter is based on a diffraction grating structured on a micro-electro-mechanical system (MEMS) which can be switched between ...
    • Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding 

      Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein (Journal article; Peer reviewed, 2016)
      The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity ...
    • Through Silicon Vias in MEMS packaging, a review 

      Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian (Lecture, 2019)
      Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) ...
    • Two-state Optical Filter Based on Micromechanical Diffractive Elements 

      Sagberg, Håkon; Bakke, Thor; Johansen, Ib-Rune; Lacolle, Matthieu Jean P; Moe, Sigurd T. (Chapter, 2007)
      We have designed a robust two-state filter for infrared gas measurement, where the filter transmittance alternates between a single bandpass function, and a double-band offset reference. The device consists of fixed and ...