Blar i SINTEF Open på forfatter "Moe, Sigurd T."
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A miniaturized pressure sensor with inherent biofouling protection designed for in vivo applications
Clausen, Ingelin; Moe, Sigurd T.; Tvedt, Lars Geir Whist; Vogl, Andreas; Wang, Dag Thorstein (Journal article; Peer reviewed, 2011)The design, fabrication, and measurement results for a diaphragm-based single crystal silicon sensor element of size 820 µm × 820 µm × 500 µm are presented. The sensor element is designed for in vivo applications with ... -
Al-Al Wafer-Level Thermocompression Bonding applied for MEMS
Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje (Chapter, 2017)Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are ... -
Conductivity of high-temperature annealed silicon direct wafer bonds
Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein (Journal article; Peer reviewed, 2015)Silicon direct wafer bonding is a process with many application areas. Depending on the application, perfect insulation or negligible resistance is desired across the bonded interface. We have investigated the resistivity ... -
Cost-effective processing of a piezoresistive MEMS cantilever sensor
Clausen, Ingelin; Moe, Sigurd T.; Vogl, Andreas (Chapter, 2011)In this paper cost-effective methods for fabrication of a piezoresistive cantilever sensor for industrial use are focused. The intended use of the presented cantilever is a medical application. A closer description of the ... -
Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin; Fournel, Frank; Moe, Sigurd T. (Journal article; Peer reviewed, 2015)The electrical, mechanical, and hermeticity properties of low-temperature, plasma activated direct silicon bonds were investigated. On individual dies with a bonding area ranging from 1–4 mm2, the bonded interface was found ... -
Fabrication of an array of silicon microscales for the monitoring of chemical processes
Lacolle, Matthieu Jean P; Johansen, Ib-Rune; Wang, Dag Thorstein; Moe, Sigurd T.; Sagberg, Håkon; Clausen, Sigmund; Karlsson, Arne; Akporiaye, Duncan (Journal article; Peer reviewed, 2012)We present the fabrication and demonstration of a two-dimensional array of scales micromachined in silicon. Each scale consists of a platform suspended by a spring. The mass present on the platform of each scale is measured ... -
Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks
Vereshchagina, Elizaveta; Poppe, Erik Utne; Schjølberg-Henriksen, Kari; Wöhrmann, Markus; Moe, Sigurd T. (Chapter, 2018)Thermo-mechanical stability of metal structures is one of the key factors affecting accuracy of micro-electromechanical (MEMS) piezoresistive pressure sensors. In this work, we present the measurement results of stress and ... -
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ... -
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ... -
Optical MEMS filter for infrared gas detection
Bakke, Thor; Lacolle, Matthieu Jean P; Sagberg, Håkon; Johansen, Ib-Rune; Moe, Sigurd T. (Lecture, 2008)An optical filter is proposed, which can be adapted to infrared detection of various gases. The filter is based on a diffraction grating structured on a micro-electro-mechanical system (MEMS) which can be switched between ... -
Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding
Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein (Journal article; Peer reviewed, 2016)The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity ... -
Through Silicon Vias in MEMS packaging, a review
Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian (Lecture, 2019)Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) ... -
Two-state Optical Filter Based on Micromechanical Diffractive Elements
Sagberg, Håkon; Bakke, Thor; Johansen, Ib-Rune; Lacolle, Matthieu Jean P; Moe, Sigurd T. (Chapter, 2007)We have designed a robust two-state filter for infrared gas measurement, where the filter transmittance alternates between a single bandpass function, and a double-band offset reference. The device consists of fixed and ...