dc.contributor.author | Sordo, Guido | |
dc.contributor.author | Collini, Cristian | |
dc.contributor.author | Moe, Sigurd T. | |
dc.contributor.author | Poppe, Erik Utne | |
dc.contributor.author | Wright, Daniel Nilsen | |
dc.date.accessioned | 2023-02-07T12:59:18Z | |
dc.date.available | 2023-02-07T12:59:18Z | |
dc.date.created | 2022-11-22T10:55:52Z | |
dc.date.issued | 2020 | |
dc.identifier.citation | 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) | en_US |
dc.identifier.isbn | 978-1-7281-6117-4 | |
dc.identifier.uri | https://hdl.handle.net/11250/3048912 | |
dc.description.abstract | It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees the advantages of the wafer scaling and provides protection of the devices during the final phase of fabrication. Direct bonding, also known as fusion bonding, is seldom implemented in MEMS fabrication due to the high surface quality required, the high temperature involved and the compulsory wet activation process. In this paper a direct bonding process for MEMS inertial sensor without the need of any wet activation step is presented. | en_US |
dc.language.iso | eng | en_US |
dc.publisher | Institute of Electrical and Electronics Engineers | en_US |
dc.relation.ispartof | 978-1-7281-6117-4 | |
dc.subject | wafer level packaging | en_US |
dc.subject | wafer bonding | en_US |
dc.subject | microsensors | en_US |
dc.subject | microfabrication | en_US |
dc.title | Wafer bonding process for zero level vacuum packaging of MEMS | en_US |
dc.title.alternative | Wafer bonding process for zero level vacuum packaging of MEMS | en_US |
dc.type | Chapter | en_US |
dc.type | Peer reviewed | en_US |
dc.description.version | acceptedVersion | en_US |
dc.rights.holder | © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en_US |
dc.source.pagenumber | 4 | en_US |
dc.identifier.doi | 10.1109/ESTC48849.2020.9229871 | |
dc.identifier.cristin | 2077980 | |
dc.relation.project | EC/H2020/785337. | en_US |
cristin.ispublished | true | |
cristin.fulltext | preprint | |
cristin.qualitycode | 1 | |