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dc.contributor.authorGraff, Joachim Moe
dc.contributor.authorSchuler, Raphael
dc.contributor.authorSong, Xin
dc.contributor.authorCastillo-Hernandez, Gustavo
dc.contributor.authorSkomedal, Gunstein
dc.contributor.authorEnebakk, Erik
dc.contributor.authorWright, Daniel Nilsen
dc.contributor.authorStange, Marit Synnøve Sæverud
dc.contributor.authorde Boor, Johannes
dc.contributor.authorLøvvik, Ole Martin
dc.contributor.authorSchrade, Matthias
dc.date.accessioned2023-02-01T17:21:58Z
dc.date.available2023-02-01T17:21:58Z
dc.date.created2021-04-26T11:21:24Z
dc.date.issued2021
dc.identifier.citationJournal of Electronic Materials. 2021, 50, 4041-4049.en_US
dc.identifier.issn0361-5235
dc.identifier.urihttps://hdl.handle.net/11250/3047820
dc.description.abstractThermoelectric modules can be used in waste heat harvesting, sensing, and cooling applications. Here, we report on the fabrication and performance of a four-leg module based on abundant silicide materials. While previously optimized Mg2Si0.3Sn0.675Bi0.025 is used as the n-type leg, we employ a fractional factorial design based on the Taguchi methods mapping out a four-dimensional parameter space among Mnx-εMoεSi1.75−δGeδ higher manganese silicide compositions for the p-type material. The module is assembled using a scalable fabrication process, using a Cu metallization layer and a Pb-based soldering paste. The maximum power output density of 53 μW cm–2 is achieved at a hot-side temperature of 250 °C and a temperature difference of 100 °C. This low thermoelectric output is related to the high contact resistance between the thermoelectric materials and the metallic contacts, underlining the importance of improved metallization schemes for thermoelectric module assembly.en_US
dc.language.isoengen_US
dc.publisherSpringeren_US
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titleFabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principlesen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.rights.holder© The Author(s) 2021en_US
dc.source.pagenumber4041-4049en_US
dc.source.journalJournal of Electronic Materialsen_US
dc.identifier.doi10.1007/s11664-021-08902-y
dc.identifier.cristin1906390
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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