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dc.contributor.authorAlex Mofid, Sohrab
dc.contributor.authorJelle, Bjørn Petter
dc.contributor.authorZhao, Xinpeng
dc.contributor.authorGao, Tao
dc.contributor.authorGrandcolas, Mathieu
dc.contributor.authorCunningham, Bridget
dc.contributor.authorNg, Serina
dc.contributor.authorYang, Ronggui
dc.date.accessioned2020-03-24T09:16:52Z
dc.date.available2020-03-24T09:16:52Z
dc.date.created2020-03-09T15:20:09Z
dc.date.issued2020
dc.identifier.citationJournal of Building Engineering. 2020, 31 1-9.en_US
dc.identifier.issn2352-7102
dc.identifier.urihttps://hdl.handle.net/11250/2648269
dc.description.abstractHollow silica nanospheres (HSNS) have been the subject of intense studies as a possible building block that may successfully bring about nano insulation materials (NIM) with substantially reduced thermal conductivity. The reported thermal conductivity values of the HSNS are currently ranged between 20 and 90 mW/(mK). In this work, we have investigated the thermal properties of HSNS as a function of the corresponding structural parameters such as inner pore diameter, porosity, shell thickness, and size of the silica nanoparticles constituting the shell of HSNS. HSNS with sizes less than 100 nm was specifically synthesized in an attempt to lower the expressed thermal conductivity values to be below 20 mW/(mK), which may be used as a potential target towards superinsulation materials used in building applications. Furthermore, synthetic approaches to gain insights into the mechanism and formation of HSNS, i.e., the influence of reaction parameters on the structural characteristics of HSNS, have been thoroughly discussed in this work.en_US
dc.language.isoengen_US
dc.publisherElsevieren_US
dc.rightsCC BY NC ND*
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectNano insulation materialen_US
dc.subjectHollow silica nanosphereen_US
dc.subjectHSNSen_US
dc.subjectSuperinsulation materialen_US
dc.subjectThermal conductivityen_US
dc.titleUtilization of Size-Tunable Hollow Silica Nanospheres for Building Thermal Insulation Applicationsen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.rights.holder© 2020 The Authors. This is an open access article under the CC BY-NC-ND licenseen_US
dc.subject.nsiVDP::Teknologi: 500en_US
dc.source.pagenumber1-9en_US
dc.source.volume31en_US
dc.source.journalJournal of Building Engineeringen_US
dc.identifier.doij.jobe.2020.101336
dc.identifier.cristin1800689
dc.relation.projectNorges forskningsråd: 250159en_US
dc.relation.projectNorges forskningsråd: 245963en_US
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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