3D stacked MEMS and ICs in a miniaturized sensor node
dc.contributor.author | Lietaer, Nicolas | |
dc.date.accessioned | 2017-02-08T11:01:04Z | |
dc.date.available | 2017-02-08T11:01:04Z | |
dc.date.created | 2015-09-24T20:01:17Z | |
dc.date.issued | 2009 | |
dc.identifier.uri | http://hdl.handle.net/11250/2429947 | |
dc.description.abstract | Solutions for through silicon viasSolutions for interconnectsDemonstrator for e-CUBES | |
dc.description.abstract | 3D stacked MEMS and ICs in a miniaturized sensor node | |
dc.language.iso | eng | nb_NO |
dc.title | 3D stacked MEMS and ICs in a miniaturized sensor node | nb_NO |
dc.type | Lecture | nb_NO |
dc.identifier.cristin | 1271682 | |
cristin.unitcode | 7401,90,31,0 | |
cristin.unitname | Mikrosystemer og nanoteknologi | |
cristin.ispublished | true | |
cristin.fulltext | original |
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