Blar i SINTEF Digital på tidsskrift "Journal of Micromechanics and Microengineering"

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    • Fabrication of an array of silicon microscales for the monitoring of chemical processes 

      Lacolle, Matthieu Jean P; Johansen, Ib-Rune; Wang, Dag Thorstein; Moe, Sigurd T.; Sagberg, Håkon; Clausen, Sigmund; Karlsson, Arne; Akporiaye, Duncan (Journal article; Peer reviewed, 2012)
      We present the fabrication and demonstration of a two-dimensional array of scales micromachined in silicon. Each scale consists of a platform suspended by a spring. The mass present on the platform of each scale is measured ...

    • Impact of SiO2 on Al–Al thermocompression wafer bonding 

      Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2015)
      Al–Al thermocompression bonding suitable for wafer level sealing of MEMS devices has been investigated. This paper presents a comparison of thermocompression bonding of Al films deposited on Si with and without a thermal ...

    • Wafer-level Au–Au bonding in the 350–450 ◦C temperature range 

      Tofteberg, Hannah Rosquist; Schjølberg-Henriksen, Kari; Fasting, Eivind Johan; Moen, Alexander Stene; Taklo, Maaike Margrete Visser; Poppe, Erik; Simensen, Christian Julius (Journal article; Peer reviewed, 2014)
      Metal thermocompression bonding is a hermetic wafer-level packaging technology that facilitates vertical integration and shrinks the area used for device sealing. In this paper, Au–Au bonding at 350, 400 and 450 °C has ...