Blar i SINTEF Digital på tidsskrift "ECS Transactions"

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    • (Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications 

      Lietaer, Nicolas; Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Journal article; Peer reviewed, 2010)
      3D integration and wafer level packaging (WLP) with through-silicon vias offer benefits like reduced footprint and improved performance. CMOS imaging sensors is one of the first successful introductions of a product with ...

    • Low-Temperature Aluminum-Aluminum Wafer Bonding 

      Rebhan, Bernhard; Hinterreiter, Andreas; Malik, Nishant; Schjølberg-Henriksen, Kari; Dragoi, Viorel; Hingerl, Kurt (Journal article; Peer reviewed, 2016)
      Aluminum-aluminum thermo-compression wafer bonding is becoming increasingly important in the production of microelectromechanical systems (MEMS) devices. As the chemically highly stable aluminum oxide layer acts as a ...

    • Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding 

      Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein (Journal article; Peer reviewed, 2016)
      The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity ...

    • The Synergistic Roles of Temperature and Pressure in Thermo-Compression Bonding of Au 

      Ambhore, Pranav; Mani, Karthick; Beekley, Brett; Malik, Nishant; Schjølberg-Henriksen, Kari; Iyer, Subramanian S.; Goorsky, Mark S. (Peer reviewed; Journal article, 2018)
      Abstract Au-Au thermocompression bonding is a widely used technique for a variety of applications including hermetic sealing and packaging at a fine pitch. We have investigated the roles of pressure and temperature ...