Blar i SINTEF Digital på tidsskrift "Journal of Micromechanics and Microengineering"
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Fabrication of an array of silicon microscales for the monitoring of chemical processes
(Journal article; Peer reviewed, 2012)We present the fabrication and demonstration of a two-dimensional array of scales micromachined in silicon. Each scale consists of a platform suspended by a spring. The mass present on the platform of each scale is measured ... -
Impact of SiO2 on Al–Al thermocompression wafer bonding
(Journal article; Peer reviewed, 2015)Al–Al thermocompression bonding suitable for wafer level sealing of MEMS devices has been investigated. This paper presents a comparison of thermocompression bonding of Al films deposited on Si with and without a thermal ... -
Wafer-level Au–Au bonding in the 350–450 ◦C temperature range
(Journal article; Peer reviewed, 2014)Metal thermocompression bonding is a hermetic wafer-level packaging technology that facilitates vertical integration and shrinks the area used for device sealing. In this paper, Au–Au bonding at 350, 400 and 450 °C has ...