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dc.contributor.authorKawamura, Akihiro
dc.contributor.authorChiba, Tomohiro
dc.contributor.authorTakahashi, Mitsuhiro
dc.contributor.authorNakamoto, Shun-ichi
dc.contributor.authorHasebe, Hisashi
dc.contributor.authorAkimoto, Takashi
dc.date.accessioned2022-01-31T13:23:57Z
dc.date.available2022-01-31T13:23:57Z
dc.date.issued2021
dc.identifier.isbn978-82-536-1728-2
dc.identifier.issn2387-4295
dc.identifier.urihttps://hdl.handle.net/11250/2976029
dc.description.abstractCombined Convection-Radiation Air Conditioning System using Building Structure combines the advantages of TABS and convection air conditioning. In ordinary TABS, pipes are buried in the frame, but here pipes are laid on the lower (ceiling) surface of the floor slab. Also, jets from a Convection-enhancing Spot fan are sprayed toward the ceiling surface, promoting convection on the frame surface. This airflow promotes timely heat dissipation stored in the frame, and a micro-airflow environment can be formed in the living area. This paper aimed to verify thermal comfort and proper operation. Subjects were given simulated work of low to high metabolic rate, and were asked to report the thermal sensation and comfort in a micro-airflow environment. It was confirmed that comfort could be maintained even at a temperature higher than the general air-conditioning temperature, and an appropriate operating method according to the metabolic rate was elucidated.
dc.language.isoeng
dc.publisherSINTEF Academic Press
dc.relation.ispartofHealthy Buildings 2021 – Europe. Proceedings of the 17th International Healthy Buildings Conference 21–23 June 2021
dc.relation.ispartofseriesSINTEF Proceedings;9
dc.rightsCC BY 4.0
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.titleVerification of Thermal Comfort of Combined Convection-Radiation Air Conditioning System using Building Structure
dc.typeChapter
dc.typePeer reviewed
dc.typeConference object
dc.description.versionpublishedVersion
dc.rights.holder© 2021 The Authors. Published by SINTEF Academic Press.
dc.subject.nsiVDP::Teknologi: 500


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