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dc.contributor.authorChristensen, Jørgen Erik
dc.contributor.authorVergo, William Kristian Krogh
dc.contributor.authorGimeno, Joan Ferris
dc.date.accessioned2020-10-21T07:39:57Z
dc.date.available2020-10-21T07:39:57Z
dc.date.issued2020
dc.identifier.isbn978-82-536-1679-7
dc.identifier.issn2387-4295
dc.identifier.urihttps://hdl.handle.net/11250/2684061
dc.description.abstractFew inhabitants in Greenland results in few small consulting companies, and they do not invest in building thermal simulation programs since they are too expensive and the use will be very limited. The aim of the paper is to describe a simplified thermal calculating design tool TCD2 for pre-designing ventilation air flow in Greenland, and thereby improving the level of calculation of the thermal indoor climate in Greenlandic buildings. In this phase, it has never been the intention to make a full validation of TCD2; however, this will take place during the next phase. The preliminary results show that the proposed design ventilation air volumes by TCD2 for annual simulations in BSim and IDA ICE meet the typical Danish/Greenlandic requirements, which are a given number of hours above 26 ºC and 27 ºC in the working hours, thus indicating that TCD2 is an alternative on the safe side to more advanced programs.en_US
dc.language.isoengen_US
dc.publisherSINTEF Academic Pressen_US
dc.relation.ispartofInternational Conference Organised by IBPSA-Nordic, 13th–14th October 2020, OsloMet. BuildSIM-Nordic 2020. Selected paper
dc.relation.ispartofseriesSINTEF Proceedings;5
dc.rightsCC-BY-NC-ND*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/deed.no*
dc.titleSimplified Tool for Pre-Designing Ventilation Air Flow in Greenlanden_US
dc.typeChapteren_US
dc.typePeer revieweden_US
dc.typeConference object
dc.description.versionpublishedVersionen_US
dc.rights.holder© The authors. Published by SINTEF Academic Press 2020 This is an open access publication under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).en_US
dc.subject.nsiVDP::Teknologi: 500en_US
dc.source.pagenumber260-267en_US


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