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dc.contributor.authorCopertaro, Benedetta
dc.contributor.authorShen, Jingchun
dc.contributor.authorSangelantoni, Lorenzo
dc.contributor.authorHuang, Pei
dc.contributor.authorZhang, Xingxing
dc.date.accessioned2020-10-21T06:50:19Z
dc.date.available2020-10-21T06:50:19Z
dc.date.issued2020
dc.identifier.isbn978-82-536-1679-7
dc.identifier.issn2387-4295
dc.identifier.urihttps://hdl.handle.net/11250/2684021
dc.description.abstractThis paper presents a numerical investigation on the effectiveness of phase change materials (PCMs) wall implementation as building refurbishment solution, under both historical and future climate conditions. Specifically, the paper aims at proofing the PCM capability of being an effective refurbishment strategy. The study is based on dynamic building simulations carried out by IDA ICE on a typical residential single zone house in Stockholm city (Sweden). Specifically, two key performance indices have been considered: total energy demand and indoor thermal comfort. The results of the simulations highlight that in lightweight building envelope, PCM can contribute to a reduction of cooling demand and improve the indoor thermal comfort under both historical and future climate. PCM results slight effectiveness in reducing heating loads. However, the annual energy saving resulted between -1.5% and -2.4% for the historical period and between -1.9% and -5.7% for the future one.en_US
dc.language.isoengen_US
dc.publisherSINTEF Academic Pressen_US
dc.relation.ispartofInternational Conference Organised by IBPSA-Nordic, 13th - 14th October 2020, OsloMet. BuildSIM-Nordic 2020. Selected papers
dc.relation.ispartofseriesSINTEF Proceedings;5
dc.rightsCC-BY-NC-ND*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/deed.no*
dc.titleAdapting to future climate change by integration of Phase Change Materials (PCMs) into the building envelope: a case study in Stockholm, Swedenen_US
dc.typeChapteren_US
dc.typePeer revieweden_US
dc.description.versionpublishedVersionen_US
dc.rights.holder© The authors. Published by SINTEF Academic Press 2020 This is an open access publication under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).en_US
dc.subject.nsiVDP::Teknologi: 500en_US
dc.source.pagenumber171-178en_US


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