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dc.contributor.authorVik, Tor Arvid
dc.contributor.authorMadessa, Habtamu Bayera
dc.contributor.authorChaudhuri, Arnab
dc.contributor.authorAamodt, Andreas
dc.contributor.authorPhengphan, Chakkrit
dc.contributor.authorAfriyie, Ebenezer Twumasi
dc.date.accessioned2020-10-21T06:37:41Z
dc.date.available2020-10-21T06:37:41Z
dc.date.issued2020
dc.identifier.isbn978-82-536-1679-7
dc.identifier.issn2387-4295
dc.identifier.urihttps://hdl.handle.net/11250/2684012
dc.description.abstractPCM enhanced wallboards on internal surfaces of building spaces is an attractive solution for improvement of thermal performance in buildings. This work deals with using a novel spackling compound as a primer coating material, from Gyproc Saint-Gobain, Sweden AB, in the inner walls of building envelopes for passive cooling and thermal comfort management. The spackling compound contains fillers, rheological additives and binding agents together with micro-encapsulated PCM. Experimental measurements and numerical simulations are performed for an office cubicle having 14 m2 floor area with and without PCM enhanced spackling material. PCM enhanced spackling has been applied on the internal walls and ceiling surface. The results show that a significant cooling effect could be achieved when covering walls and ceiling with PCM enhanced spackling directly exposed to the occupied zone. Furthermore, a parametric study shows that the PCM’s thickness, and the nighttime ventilation airflow rate and supply air temperature have considerable impact on the cooling performance.en_US
dc.language.isoengen_US
dc.publisherSINTEF Academic Pressen_US
dc.relation.ispartofInternational Conference Organised by IBPSA-Nordic, 13th - 14th October 2020, OsloMet. BuildSIM-Nordic 2020. Selected papers
dc.relation.ispartofseriesSINTEF Proceedings;5
dc.rightsCC BY NC ND*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/deed.no*
dc.titleExperimental and numerical studies on thermal performance of an office cubicle having gypsum boards coated with PCM-enhanced spacklingen_US
dc.typeChapteren_US
dc.typePeer revieweden_US
dc.description.versionpublishedVersionen_US
dc.rights.holder© The authors. Published by SINTEF Academic Press 2020en_US
dc.subject.nsiVDP::Teknologi: 500en_US
dc.identifier.cristin1839935


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