Blar i Publikasjoner fra CRIStin - SINTEF AS på emneord "wafer level packaging"

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    • Wafer bonding process for zero level vacuum packaging of MEMS 

      Sordo, Guido; Collini, Cristian; Moe, Sigurd T.; Poppe, Erik Utne; Wright, Daniel Nilsen (Chapter; Peer reviewed, 2020)
      It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees ...