Browsing SINTEF Open by Author "Taklo, Maaike Margrete Visser"
Now showing items 1-13 of 13
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3D Integration Technologies for Wireless Sensor Systems (e-CUBES)
Taklo, Maaike Margrete Visser (Lecture, 2008)The innovative approach presented here will realize so-called e-CUBES® (electronic cubes) [1], i.e. investigate and develop ultra small sensor cubes with dimensions of a few mm3 which are wirelessly communicating among ... -
3D Integration Technologies for Wireless Sensor Systems (e-CUBES)
Taklo, Maaike Margrete Visser (Lecture, 2008)The innovative approach presented here will realize so-called e-CUBES® (electronic cubes) [1], i.e. investigate and develop ultra small sensor cubes with dimensions of a few mm3 which are wirelessly communicating among ... -
3D interconnect technologies for advanced MEMS/NEMS applications
Lietaer, Nicolas; Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Lecture, 2009) -
A 2.5-D Integrated Data Logger for Measuring Extreme Accelerations
Gakkestad, Jakob; Sollund, Tomas; Dalsjø, Per; Tveit, Bjørn; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Helland, Susanne; Kristiansen, Helge; Johnsen, Christian (Journal article; Peer reviewed, 2017)A very compact and rugged 2.5-D integrated data logger has been built and tested. The data logger is capable of measuring accelerations exceeding 70 000 g. Microcontroller and flash memory as bare dies have been mounted ... -
Acoustic/Electronic stack design, interconnect, and assembly. Techniques available and under development
Taklo, Maaike Margrete Visser (Lecture, 2009)Acoustic/Electronic stack design, interconnect, and assemblyTechniques available and under development -
Al-Al thermocompression bonding for wafer-level MEMS sealing
Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2014)Al–Al thermocompression bonding has been studied using test structures relevant for wafer level sealing of MEMS devices. Si wafers with protruding frame structures were bonded to planar Si wafers, both covered with a ... -
Bending machine for testing reliability of flexible electronics
Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike Margrete Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn (Chapter, 2017)A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of ... -
Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity
Malik, Nishant; Poppe, Erik; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2015)Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying different bonding parameters have been investigated. Laminates of diameter 150 mm were realized by bonding wafers containing ... -
Impact of SiO2 on Al–Al thermocompression wafer bonding
Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2015)Al–Al thermocompression bonding suitable for wafer level sealing of MEMS devices has been investigated. This paper presents a comparison of thermocompression bonding of Al films deposited on Si with and without a thermal ... -
Interconnects based on metal coated polymer spheres for improved reliability
Taklo, Maaike Margrete Visser; Larsson, Andreas; Aasmundtveit, Knut E.; Kristiansen, Helge (Lecture, 2011)3D packaging and heterogeneous integration has revealed new opportunities with regard to where instrumentation can be applied. Extreme miniaturization of systems makes it possible to include sensors and electronics in ... -
Technologies enabling 3D stacking of MEMS
Taklo, Maaike Margrete Visser; Mielnik, Michal Marek; Schjølberg-Henriksen, Kari; Storås, Preben; Tofteberg, Hannah Rosquist; Lietaer, Nicolas; Johannessen, Rolf (Chapter, 2010) -
TSV development for miniaturized MEMS acceleration switch
Lietaer, Nicolas; Summanwar, Anand; Bakke, Thor; Taklo, Maaike Margrete Visser; Dalsjø, Per G. (Chapter, 2011)Fragile micromachined MEMS structures are usually protected by bonding a capping wafer to the device wafer itself. As opposed to using lateral interconnects at the interface between the cap wafer and the device wafer, the ... -
Wafer-level Au–Au bonding in the 350–450 ◦C temperature range
Tofteberg, Hannah Rosquist; Schjølberg-Henriksen, Kari; Fasting, Eivind Johan; Moen, Alexander Stene; Taklo, Maaike Margrete Visser; Poppe, Erik; Simensen, Christian Julius (Journal article; Peer reviewed, 2014)Metal thermocompression bonding is a hermetic wafer-level packaging technology that facilitates vertical integration and shrinks the area used for device sealing. In this paper, Au–Au bonding at 350, 400 and 450 °C has ...