• Al-Al thermocompression bonding for wafer-level MEMS sealing 

      Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2014)
      Al–Al thermocompression bonding has been studied using test structures relevant for wafer level sealing of MEMS devices. Si wafers with protruding frame structures were bonded to planar Si wafers, both covered with a ...
    • Single digit parts-per-billion NOx detection using MoS2/hBN transistors 

      Ali, Ayaz; Koybasi, Ozhan; Xing, Wen; Wright, Daniel Nilsen; Varandani, Deepak; Taniguchi, Takashi; Watanabe, Kenji; Mehta, Bodh R.; Belle, Branson (Peer reviewed; Journal article, 2020)
      2D materials offer excellent possibilities for high performance gas detection due to their high surface-to-volume ratio, high surface activities, tunable electronic properties and dramatic change in resistivity upon molecular ...