Browsing SINTEF Open by Author "Tollefsen, Torleif Andre"
Now showing items 1-3 of 3
-
Electronic packaging for harsh environments
Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif (Lecture, 2016) -
High Temperature Power Electronics Packaging
Larsson, Andreas; Tollefsen, Torleif Andre; Storstrøm, Olav Barros; Fallet, Truls (SINTEF Rapport;, Research report, 2013)The lack of robust and reliable packaging methods are considered to be one of the main challenges for the next generation of high temperature electronics (>200 °C). Power electronics are especially difficult to operate in ... -
A Review of Eutectic Au-Ge Solder Joints
Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut (Journal article; Peer reviewed, 2019)Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. ...