Browsing SINTEF Open by Journals "Superlattices and Microstructures"
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Texture of Al films for wafer-level thermocompression bonding
(Journal article; Peer reviewed, 2017)Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were ...