Blar i SINTEF Open på tidsskrift "Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems"
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Conductivity of high-temperature annealed silicon direct wafer bonds
(Journal article; Peer reviewed, 2015)Silicon direct wafer bonding is a process with many application areas. Depending on the application, perfect insulation or negligible resistance is desired across the bonded interface. We have investigated the resistivity ... -
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
(Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ... -
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
(Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ...