Browsing SINTEF Open by Author "Wright, Daniel Nilsen"

Now showing items 1-8 of 8

    • A 2.5-D Integrated Data Logger for Measuring Extreme Accelerations 

      Gakkestad, Jakob; Sollund, Tomas; Dalsjø, Per; Tveit, Bjørn; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Helland, Susanne; Kristiansen, Helge; Johnsen, Christian (Journal article; Peer reviewed, 2017)
      A very compact and rugged 2.5-D integrated data logger has been built and tested. The data logger is capable of measuring accelerations exceeding 70 000 g. Microcontroller and flash memory as bare dies have been mounted ...

    • Bending machine for testing reliability of flexible electronics 

      Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike Margrete Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn (Chapter, 2017)
      A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of ...

    • Cubic silicon carbide as a potential photovoltaic material 

      Syväjärvi, Mikael; Ma, Quanbao; Jokubavicius, Valdas; Galeckas, Augustinas; Sun, Jianwu; Liu, Xinyu; Jansson, Mattias; Wellmann, Peter; Linnarsson, Margareta; Runde, Paal; Johansen, Bertil; Thøgersen, Annett; Diplas, Spyridon; Carvalho, Patricia; Løvvik, Ole Martin; Wright, Daniel Nilsen; Azarov, Alexander; Svensson, Bengt Gunnar (Peer reviewed; Journal article, 2016)
      In this work we present a significant advancement in cubic silicon carbide (3C-SiC) growth in terms of crystal quality and domain size, and indicate its potential use in photovoltaics. To date, the use of 3C-SiC for ...

    • Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles 

      Graff, Joachim Moe; Schuler, Raphael; Song, Xin; Castillo-Hernandez, Gustavo; Skomedal, Gunstein; Enebakk, Erik; Wright, Daniel Nilsen; Stange, Marit Synnøve Sæverud; de Boor, Johannes; Løvvik, Ole Martin; Schrade, Matthias (Peer reviewed; Journal article, 2021)
      Thermoelectric modules can be used in waste heat harvesting, sensing, and cooling applications. Here, we report on the fabrication and performance of a four-leg module based on abundant silicide materials. While previously ...

    • Single digit parts-per-billion NOx detection using MoS2/hBN transistors 

      Ali, Ayaz; Koybasi, Ozhan; Xing, Wen; Wright, Daniel Nilsen; Varandani, Deepak; Taniguchi, Takashi; Watanabe, Kenji; Mehta, Bodh R.; Belle, Branson (Peer reviewed; Journal article, 2020)
      2D materials offer excellent possibilities for high performance gas detection due to their high surface-to-volume ratio, high surface activities, tunable electronic properties and dramatic change in resistivity upon molecular ...

    • Smart Tags that are exactly Reliable Enough 

      Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus (Chapter, 2017)
      Smart tags for fast moving consumer goods are among the products predicted to be part of the Internet of Everything. The tags must be extremely low cost, be fabricated in huge volumes, and have a quality accepted by the ...

    • Through Silicon Vias in MEMS packaging, a review 

      Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian (Lecture, 2019)
      Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) ...

    • Wafer bonding process for zero level vacuum packaging of MEMS 

      Sordo, Guido; Collini, Cristian; Moe, Sigurd T.; Poppe, Erik Utne; Wright, Daniel Nilsen (Chapter; Peer reviewed, 2020)
      It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees ...