Browsing SINTEF Open by Author "Taklo, Maaike M. Visser"

Now showing items 1-5 of 5

    • 3D Integration technology: Status and application development 

      Ramm, Peter; Klumpp, Armin; Weber, Josef; Lietaer, Nicolas; Taklo, Maaike M. Visser; de Raedt, W.; Fritzsch, Thomas; Couderc, Pascal (Journal article; Peer reviewed, 2010)
      As predicted by the ITRS roadmap, semiconductor industry development dominated by shrinking transistor gate dimensions alone will not be able to overcome the performance and cost problems of future IC fabrication. Today ...

    • Al-Al Wafer-Level Thermocompression Bonding applied for MEMS 

      Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje (Chapter, 2017)
      Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are ...

    • (Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications 

      Lietaer, Nicolas; Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Journal article; Peer reviewed, 2010)
      3D integration and wafer level packaging (WLP) with through-silicon vias offer benefits like reduced footprint and improved performance. CMOS imaging sensors is one of the first successful introductions of a product with ...

    • Smart Tags that are exactly Reliable Enough 

      Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus (Chapter, 2017)
      Smart tags for fast moving consumer goods are among the products predicted to be part of the Internet of Everything. The tags must be extremely low cost, be fabricated in huge volumes, and have a quality accepted by the ...

    • Texture of Al films for wafer-level thermocompression bonding 

      Malik, Nishant; Venkatachalapathy, Vishnukanthan; Dall, Wilhelm; Schjølberg-Henriksen, Kari; Poppe, Erik Utne; Taklo, Maaike M. Visser; Finstad, Terje (Journal article; Peer reviewed, 2017)
      Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were ...