Browsing SINTEF Open by Author "Aasmundtveit, Knut Eilif"

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Electronic packaging for harsh environments

Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif (Lecture, 2016)
Gold to gold thermosonic bonding Characterization of bonding parameters

Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Høivik, Nils Deneke; Aasmundtveit, Knut Eilif (Chapter, 2010)

The aim of this study is to characterize a die attach method suitable for harsh environment as well as high reliability applications. Au-Au thermosonic bonding was selected. Due to high melting temperature of gold, this ...