• High Temperature Power Electronics Packaging 

      Larsson, Andreas; Tollefsen, Torleif Andre; Storstrøm, Olav Barros; Fallet, Truls (SINTEF Rapport;, Research report, 2013)
      The lack of robust and reliable packaging methods are considered to be one of the main challenges for the next generation of high temperature electronics (>200 °C). Power electronics are especially difficult to operate in ...