• Texture of Al films for wafer-level thermocompression bonding 

      Malik, Nishant; Venkatachalapathy, Vishnukanthan; Dall, Wilhelm; Schjølberg-Henriksen, Kari; Poppe, Erik Utne; Taklo, Maaike M. Visser; Finstad, Terje (Journal article; Peer reviewed, 2017)
      Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were ...