Blar i SINTEF Open på emneord "Intermetallic growth rate"
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Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process
(Peer reviewed; Journal article, 2022)Advances in joining processes for aluminum and copper are sought after to facilitate the greater adoption of aluminum in electrical applications. Aluminum's chemical affinity to copper causes the joining and lifetime of ...