Browsing SINTEF Open by Author "Larsson, Andreas"
Now showing items 1-10 of 10
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Anisotropic conductive film for flip-chip interconnection of a high I/O silicon based finger print sensor
Larsson, Andreas; Oldervoll, Frøydis; Seip, Torleif Andre Tollefsen; Nguyen, Hoang Vu; Kristiansen, Helge; Sløgedal, Øyvind (Lecture, 2011) -
Bonding technology for rough environments
Larsson, Andreas (Lecture, 2010) -
Electronic packaging for harsh environments
Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif (Lecture, 2016) -
Gold to gold thermosonic bonding Characterization of bonding parameters
Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Høivik, Nils Deneke; Aasmundtveit, Knut Eilif (Chapter, 2010)The aim of this study is to characterize a die attach method suitable for harsh environment as well as high reliability applications. Au-Au thermosonic bonding was selected. Due to high melting temperature of gold, this ... -
High Temperature Power Electronics Packaging
Larsson, Andreas; Tollefsen, Torleif Andre; Storstrøm, Olav Barros; Fallet, Truls (SINTEF Rapport;, Research report, 2013)The lack of robust and reliable packaging methods are considered to be one of the main challenges for the next generation of high temperature electronics (>200 °C). Power electronics are especially difficult to operate in ... -
Interconnects based on metal coated polymer spheres for improved reliability
Taklo, Maaike Margrete Visser; Larsson, Andreas; Aasmundtveit, Knut E.; Kristiansen, Helge (Lecture, 2011)3D packaging and heterogeneous integration has revealed new opportunities with regard to where instrumentation can be applied. Extreme miniaturization of systems makes it possible to include sensors and electronics in ... -
Performance of a Thermal Management System for Thermophoresis Based Soot Sensors - Design, Performance and Verification
Larsson, Andreas; Storstrøm, Olav Barros; Seip, Torleif A.T.; Hjelstuen, Magnus; Bjorklund, R.; Lloyd, Spetz A.; Johansson, M.L.; Grant, A.; Jozsa, P.; Fägerman, P.-E.; Paaso, J.; Hammarlund, L. (Journal article; Peer reviewed, 2010) -
Resistance sensor employing thermophoresis for soot in diesel exhaust
Larsson, Andreas (Lecture, 2009)To reduce particle emissions from diesel engines, sensors based on resistance change of soot collected on interdigitated electrodes have been introduced [1]. Sensitivity depends on the known mechanisms of soot deposition ... -
A Review of Eutectic Au-Ge Solder Joints
Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut (Journal article; Peer reviewed, 2019)Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. ... -
Thermal modelling of a thick film based soot sensor for automotive applications
Larsson, Andreas (Lecture, 2009)