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dc.contributor.authorBunaziv, Ivan
dc.contributor.authorDørum, Cato
dc.contributor.authorNielsen, Steen Erik
dc.contributor.authorSuikkanen, Pasi
dc.contributor.authorRen, Xiaobo
dc.contributor.authorNyhus, Bård
dc.contributor.authorEriksson, Magnus Carl Fredrik
dc.contributor.authorAkselsen, Odd Magne
dc.date.accessioned2022-03-24T09:46:36Z
dc.date.available2022-03-24T09:46:36Z
dc.date.created2022-01-11T13:00:04Z
dc.date.issued2021
dc.identifier.citationIOP Conference Series: Materials Science and Engineering. 2021, 1135 .en_US
dc.identifier.issn1757-8981
dc.identifier.urihttps://hdl.handle.net/11250/2987267
dc.description.abstractDeep penetration laser welding is promising in joining thick (> 10 mm) steel sections. Focused laser beam by drilling vapour cavity, the keyhole, generates deep and narrow welds. Full penetration single-pass joining has a persistent problem with root quality where humping is one of the most frequent imperfection. This strongly hampers the use of high-power laser for thick plate welding. A 16 kW disk laser was used for single-pass welding of 15 mm thick plates in a butt joint configuration. Root humping occurred within a wide range of welding parameters. This provides narrow processing window. By adding an arc source to the laser beam process, the tendency of root humping increases. To achieve humping-free welds and consistent root quality over length, a delicate balance of process parameters is required. High heat input (> 0.50 kJ/mm) was positive to achieve a combination of low hardness (< 325 HV) and good Charpy toughness at -50 °C (> 50 J).en_US
dc.language.isoengen_US
dc.publisherIOP Scienceen_US
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titleRoot formation and mechanical properties in laser keyhole welding of 15 mm thick HSLA steelen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.rights.holderThe Authors. Content from this work may be used under the terms of theCreative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltden_US
dc.source.pagenumber11en_US
dc.source.volume1135en_US
dc.source.journalIOP Conference Series: Materials Science and Engineeringen_US
dc.identifier.doi10.1088/1757-899x/1135/1/012011
dc.identifier.cristin1978319
dc.relation.projectNorges forskningsråd: 309584en_US
dc.source.articlenumber012011en_US
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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Navngivelse 4.0 Internasjonal
Except where otherwise noted, this item's license is described as Navngivelse 4.0 Internasjonal