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dc.contributor.authorGakkestad, Jakob
dc.contributor.authorSollund, Tomas
dc.contributor.authorDalsjø, Per
dc.contributor.authorTveit, Bjørn
dc.contributor.authorTaklo, Maaike Margrete Visser
dc.contributor.authorWright, Daniel Nilsen
dc.contributor.authorHelland, Susanne
dc.contributor.authorKristiansen, Helge
dc.contributor.authorJohnsen, Christian
dc.date.accessioned2018-01-03T08:56:21Z
dc.date.available2018-01-03T08:56:21Z
dc.date.created2018-01-02T14:22:20Z
dc.date.issued2017
dc.identifier.citationIEEE Transactions on Components, Packaging, and Manufacturing Technology. 2017, 7 (12), 1930-1939.nb_NO
dc.identifier.issn2156-3950
dc.identifier.urihttp://hdl.handle.net/11250/2474223
dc.description.abstractA very compact and rugged 2.5-D integrated data logger has been built and tested. The data logger is capable of measuring accelerations exceeding 70 000 g. Microcontroller and flash memory as bare dies have been mounted onto a silicon interposer with through silicon vias using anisotropic conductive film and Au stud bump bonding. A microelectromechanical system accelerometer is mounted onto the interposer, using a robust customized flip-chip mounting approach. The interposer is mounted into a 16-pin leadless chip carrier package using isotropic conductive adhesive, where the conductive part is made of metallized polymer spheres. The ceramic package was mounted onto an application printed circuit board (PCB) with filters, power management, and an interface contact, using soldered plastic core solder balls (PCSBs). The diameter of the data logger is less than 9 mm, and the height is approximately 5 mm. The data logger fits within 12.7-mm (0.50 cal.) projectile, and acceleration measurements have been performed during firing, flight, and recovery. The measured accelerations have been verified by comparing the calculated projectile muzzle velocities with Doppler radar measurements.nb_NO
dc.language.isoengnb_NO
dc.titleA 2.5-D Integrated Data Logger for Measuring Extreme Accelerationsnb_NO
dc.typeJournal articlenb_NO
dc.typePeer reviewednb_NO
dc.description.versionpublishedVersionnb_NO
dc.source.pagenumber1930-1939nb_NO
dc.source.volume7nb_NO
dc.source.journalIEEE Transactions on Components, Packaging, and Manufacturing Technologynb_NO
dc.source.issue12nb_NO
dc.identifier.doi10.1109/TCPMT.2017.2766263
dc.identifier.cristin1533877
cristin.unitcode7401,90,0,0
cristin.unitcode7401,90,32,0
cristin.unitnameSINTEF IKT
cristin.unitnameInstrumentering
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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