dc.contributor.author | Rebhan, Bernhard | |
dc.contributor.author | Hinterreiter, Andreas | |
dc.contributor.author | Malik, Nishant | |
dc.contributor.author | Schjølberg-Henriksen, Kari | |
dc.contributor.author | Dragoi, Viorel | |
dc.contributor.author | Hingerl, Kurt | |
dc.date.accessioned | 2017-12-19T07:58:33Z | |
dc.date.available | 2017-12-19T07:58:33Z | |
dc.date.created | 2016-09-28T19:19:29Z | |
dc.date.issued | 2016 | |
dc.identifier.citation | ECS Transactions. 2016, 75 (9), 15-24. | nb_NO |
dc.identifier.issn | 1938-5862 | |
dc.identifier.uri | http://hdl.handle.net/11250/2472662 | |
dc.description.abstract | Aluminum-aluminum thermo-compression wafer bonding is becoming increasingly important in the production of microelectromechanical systems (MEMS) devices. As the chemically highly stable aluminum oxide layer acts as a diffusion barrier between the two aluminum metallization layers, up to now the process has required bonding temperatures of 300°C or more. By using the EVG®580 ComBond® system, in which a surface treatment and subsequent wafer bonding are both performed in a high vacuum cluster, for the first time successful Al-Al wafer bonding was possible at a temperature of 100°C. The bonded interfaces of blank Al wafers and Al wafers with patterned frames were characterized using C-mode scanning acoustic microscopy (C-SAM) and transmission electron microscopy (TEM) as well as dicing yield and pull tests representative for the bonding strength. The investigations revealed areas of oxide-free, atomic contact at the Al-Al bonded interface. | nb_NO |
dc.language.iso | eng | nb_NO |
dc.title | Low-Temperature Aluminum-Aluminum Wafer Bonding | nb_NO |
dc.type | Journal article | nb_NO |
dc.type | Peer reviewed | nb_NO |
dc.description.version | acceptedVersion | nb_NO |
dc.source.pagenumber | 15-24 | nb_NO |
dc.source.volume | 75 | nb_NO |
dc.source.journal | ECS Transactions | nb_NO |
dc.source.issue | 9 | nb_NO |
dc.identifier.doi | 10.1149/07509.0015ecst | |
dc.identifier.cristin | 1387162 | |
dc.relation.project | Norges forskningsråd: 247781 | nb_NO |
cristin.unitcode | 7401,90,31,0 | |
cristin.unitname | Mikrosystemer og nanoteknologi | |
cristin.ispublished | true | |
cristin.fulltext | postprint | |
cristin.qualitycode | 1 | |