3D stacked MEMS and ICs in a miniaturized sensor node

dc.contributor.author	Lietaer, Nicolas
dc.date.accessioned	2017-02-13T09:24:18Z
dc.date.available	2017-02-13T09:24:18Z
dc.date.created	2015-09-24T20:01:19Z
dc.date.issued	2009
dc.identifier.citation	Design, Test, Integration and Packaging of MEMS/MOEMS 2009	nb_NO
dc.identifier.isbn	9782355000096
dc.identifier.uri	http://hdl.handle.net/11250/2430379
dc.description.abstract	3D integration of micro electromechanical systems (MEMS) is expected to reduce the foot print of existing MEMS products and enable production of miniaturized sensor nodes on a large scale. However, 3D integration of MEMS is in general different from 3D integration of planar integrated circuits (ICs) due to additional mechanical requirements. Specifications regarding properties like stiffness, volume, and mass must be taken into consideration when selecting stacking technologies for MEMS. A demonstrator with a 3D integrated MEMS and the ideas behind the selection of stacking technologies are presented in this paper.
dc.description.abstract	3D stacked MEMS and ICs in a miniaturized sensor node
dc.language.iso	eng	nb_NO
dc.relation.ispartof	Design, Test, Integration and Packaging of MEMS/MOEMS 2009
dc.title	3D stacked MEMS and ICs in a miniaturized sensor node	nb_NO
dc.type	Chapter	nb_NO
dc.source.pagenumber	74-77	nb_NO
dc.identifier.cristin	1271683
cristin.unitcode	7401,90,31,0
cristin.unitname	Mikrosystemer og nanoteknologi
cristin.ispublished	true
cristin.fulltext	postprint
cristin.qualitycode	1