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A Clover shaped silicon piezoresistive microphone for miniaturized photoacoustic gas sensors

dc.contributor.authorGrinde, Christopher
dc.contributor.authorØhlckers, Per
dc.contributor.authorMielnik, M.
dc.contributor.authorJensen, Geir Uri
dc.contributor.authorWang, DT
dc.date.accessioned2017-02-08T10:59:52Z
dc.date.available2017-02-08T10:59:52Z
dc.date.created2009-10-23T00:00:00Z
dc.date.issued2009
dc.identifier.citationSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. DTIP MEMS/MOEMS '09nb_NO
dc.identifier.urihttp://hdl.handle.net/11250/2429946
dc.description.abstractHere we present the design and modeling of a novel piezoresistive microphone designed for a photoacoustic gas sensor system. The microphone is fabricated using a novel process to enable DRIE etch through of membranes of multiple thickness.
dc.description.abstractA Clover shaped silicon piezoresistive microphone for miniaturized photoacoustic gas sensors
dc.language.isoengnb_NO
dc.relation.ispartofSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. DTIP MEMS/MOEMS '09
dc.subjectMEMS
dc.titleA Clover shaped silicon piezoresistive microphone for miniaturized photoacoustic gas sensorsnb_NO
dc.typeChapternb_NO
dc.source.pagenumber256-260nb_NO
dc.identifier.cristin653538
cristin.unitcode7401,90,0,0
cristin.unitnameSINTEF IKT
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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