• 3D Integration technology: Status and application development 

      Ramm, Peter; Klumpp, Armin; Weber, Josef; Lietaer, Nicolas; Taklo, Maaike M. Visser; de Raedt, W.; Fritzsch, Thomas; Couderc, Pascal (Journal article; Peer reviewed, 2010)
      As predicted by the ITRS roadmap, semiconductor industry development dominated by shrinking transistor gate dimensions alone will not be able to overcome the performance and cost problems of future IC fabrication. Today ...
    • 3D interconnect technologies for advanced MEMS/NEMS applications 

      Lietaer, Nicolas; Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Lecture, 2009)
    • (Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications 

      Lietaer, Nicolas; Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Journal article; Peer reviewed, 2010)
      3D integration and wafer level packaging (WLP) with through-silicon vias offer benefits like reduced footprint and improved performance. CMOS imaging sensors is one of the first successful introductions of a product with ...