• Interconnects based on metal coated polymer spheres for improved reliability 

      Taklo, Maaike Margrete Visser; Larsson, Andreas; Aasmundtveit, Knut E.; Kristiansen, Helge (Lecture, 2011)
      3D packaging and heterogeneous integration has revealed new opportunities with regard to where instrumentation can be applied. Extreme miniaturization of systems makes it possible to include sensors and electronics in ...