Browsing Publikasjoner fra CRIStin by Journals "ECS Journal of Solid State Science and Technology"
Now showing items 1-3 of 3
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Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
(Journal article; Peer reviewed, 2015)The electrical, mechanical, and hermeticity properties of low-temperature, plasma activated direct silicon bonds were investigated. On individual dies with a bonding area ranging from 1–4 mm2, the bonded interface was found ... -
Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity
(Journal article; Peer reviewed, 2015)Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying different bonding parameters have been investigated. Laminates of diameter 150 mm were realized by bonding wafers containing ... -
Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
(Journal article; Peer reviewed, 2015)Hermeticity, reliability and strength of four laminates bonded at different temperatures by Au-Au thermocompression bonding have been investigated. Laminates with a diameter of 150 mm were realized by bonding a wafer ...