Blar i Publikasjoner fra CRIStin på forfatter "Bai, Tingyu"
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Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding
Goorsky, Mark S.; Schjølberg-Henriksen, Kari; Beekley, Brett; Bai, Tingyu; Mani, Karthick; Ambhore, Pranav; Bajwa, Adeel; Malik, Nishant; Iyer, Subramanian S. (Journal article; Peer reviewed, 2017)Au-Au thermocompression bonding is a versatile technique of high interest for a variety of applications. We have investigated Au-Au bonding using sputter deposited Au films under conditions of low temperature (150-250 °C) ...