Blar i SINTEF Industri på forfatter "Tetlie, Pål"
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Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw
Ryningen, Birgit; Tetlie, Pål; Johnsen, Sverre Gullikstad; Dalaker, Halvor (Peer reviewed; Journal article, 2020)Succeeding with ultrathin silicon wafer sawing by diamond multi-wire saw, is not only a matter of optimization; the challenges of thin wafer production and the capability limit have not yet been fully understood. In this ... -
Novel technique to study the wet chemical etching response of multi-crystalline silicon wafers
Matkivskyi, Vladyslav; Røyset, Arne Karstein; Stokkan, Gaute; Tetlie, Pål; Sabatino, Marisa Di; Tranell, Gabriella (Peer reviewed; Journal article, 2022)The current work aimed to demonstrate the application of a technique where white light interferometry (WLI) and Laue X-ray crystallography scanner characterisation were combined to study the chemical etching response of ...