Blar i SINTEF Open på forfatter "Tismer, Sebastian"
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Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ... -
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the ...