Browsing SINTEF Open by Author "Rebhan, Bernhard"
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Low-Temperature Aluminum-Aluminum Wafer Bonding
Rebhan, Bernhard; Hinterreiter, Andreas; Malik, Nishant; Schjølberg-Henriksen, Kari; Dragoi, Viorel; Hingerl, Kurt (Journal article; Peer reviewed, 2016)Aluminum-aluminum thermo-compression wafer bonding is becoming increasingly important in the production of microelectromechanical systems (MEMS) devices. As the chemically highly stable aluminum oxide layer acts as a ...