Browsing SINTEF Open by Author "Lietaer, Nicolas"
Now showing items 1-20 of 20
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2nd run of full 3-D detectors
Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand (Lecture, 2009) -
3D Integration technology: Status and application development
Ramm, Peter; Klumpp, Armin; Weber, Josef; Lietaer, Nicolas; Taklo, Maaike M. Visser; de Raedt, W.; Fritzsch, Thomas; Couderc, Pascal (Journal article; Peer reviewed, 2010)As predicted by the ITRS roadmap, semiconductor industry development dominated by shrinking transistor gate dimensions alone will not be able to overcome the performance and cost problems of future IC fabrication. Today ... -
3D interconnect technologies for advanced MEMS/NEMS applications
Lietaer, Nicolas; Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Lecture, 2009) -
3D stacked MEMS and ICs in a miniaturized sensor node
Lietaer, Nicolas (Chapter, 2009)3D integration of micro electromechanical systems (MEMS) is expected to reduce the foot print of existing MEMS products and enable production of miniaturized sensor nodes on a large scale. However, 3D integration of MEMS ... -
3D stacked MEMS and ICs in a miniaturized sensor node
Lietaer, Nicolas (Lecture, 2009)Solutions for through silicon viasSolutions for interconnectsDemonstrator for e-CUBES -
Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for the Super-LHC
Koybasi, Ozhan; Bortoletto, Daniela; Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand; Bolla, Gino; Kwan, Simon Wing Lok (Journal article; Peer reviewed, 2010) -
Development and fabrication of full 3D-sensors at SINTEF MiNaLab
Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand (Lecture, 2009) -
Electrical Characterization and Preliminary Beam Test Results of 3D Silicon CMS Pixel Detectors
Koybasi, Ozhan; Alagoz, Enver; Krzywda, Alex; Arndt, Kirk; Bolla, Gina; Bortoletto, Daniela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Kok, Angela Chun Ying; Kwan, Simon; Lietaer, Nicolas; Rivera, Ryan; Shipsey, Ian; Uplegger, Lorenzo; Da Via, Cinzia (Journal article; Peer reviewed, 2011)The fabrication of 3D detectors which requires bulk micromachining of columnar electrodes has been realized with advancements in MEMS technology. Since the fabrication of the first 3D prototype in Stanford Nanofabrication ... -
Etching buried oxide at the bottom of high aspect ratio structures
Summanwar, Anand; Lietaer, Nicolas (Lecture, 2011)Plasma based dry etching is a key process widely used in micro-fabrication today. In this article, we look at the challenges involved in the anisotropic etching of buried SiO2 layers at the bottom of high aspect ratio ... -
Etching Burried Oxide at the Bottom of High Aspect Ratio Structures
Summanwar, Anand; Lietaer, Nicolas (Chapter, 2011)Plasma based dry etching is a key process widely used in micro-fabrication today. In this article, we look at the challenges involved in the anisotropic etching of buried SiO2 layers at the bottom of high aspect ratio ... -
High aspect ratio deep RIE for novel 3D radiation sensors in high energy physics applications
Kok, Angela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Lietaer, Nicolas; Mielnik, Michal Marek; Storås, Preben (Journal article; Peer reviewed, 2009)3D detectors with electrodes penetrating through the entire silicon substrate have many advantages over conventional planar silicon technology, for example, high radiation tolerance. High aspect ratio through-wafer holes ... -
(Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications
Lietaer, Nicolas; Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Journal article; Peer reviewed, 2010)3D integration and wafer level packaging (WLP) with through-silicon vias offer benefits like reduced footprint and improved performance. CMOS imaging sensors is one of the first successful introductions of a product with ... -
Latest Results From 2nd SINTEF 3D-Run
Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand (Lecture, 2009) -
MEMS Sensor/IC Integration for Miniaturized TPMS (e-CUBES)
Lietaer, Nicolas (Lecture, 2008)Sensor networks are researched in various automotive applications, in particular in tirepressure monitoring systems (TPMS) installed as autonomous sensor nodes. A tire-mounted TPMS should ideally weight less than 5 grams ... -
Next lot of 3-D detectors at SINTEF
Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Mielnik, Michal Marek; storås, Preben; Jensen, Geir Uri (Lecture, 2009) -
Technologies enabling 3D stacking of MEMS
Taklo, Maaike Margrete Visser; Mielnik, Michal Marek; Schjølberg-Henriksen, Kari; Storås, Preben; Tofteberg, Hannah Rosquist; Lietaer, Nicolas; Johannessen, Rolf (Chapter, 2010) -
The SiRi particle-telescope system
Guttormsen, Magne Sveen; Bürger, Alexander; Hansen, Thor-Erik; Lietaer, Nicolas (Journal article; Peer reviewed, 2011)A silicon particle-telescope system for light-ion nuclear reactions is described. In particular, the system is optimized for level density and γ‐ray strength function measurements with the so-called Oslo method. Eight ... -
TSV development for miniaturized MEMS acceleration switch
Lietaer, Nicolas; Summanwar, Anand; Bakke, Thor; Taklo, Maaike Margrete Visser; Dalsjø, Per G. (Chapter, 2011)Fragile micromachined MEMS structures are usually protected by bonding a capping wafer to the device wafer itself. As opposed to using lateral interconnects at the interface between the cap wafer and the device wafer, the ... -
TSV development for miniaturized MEMS acceleration switch
Lietaer, Nicolas; Summanwar, Anand; Dalsjø, Per G.; Bakke, Thor; Tofteberg, Hannah Rosquist (Lecture, 2010)Fragile micromachined MEMS structures are usually protected by bonding a capping wafer to the device wafer itself. As opposed to using lateral interconnects at the interface between the cap wafer and the device wafer, the ... -
Wafer-level packaged MEMS switch with TSV
Lietaer, Nicolas; Bakke, Thor; Summanwar, Anand; Dalsjø, Per G.; Gakkestad, Jakob; Niklaus, Frank (Lecture, 2011)