• 2nd run of full 3-D detectors 

      Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand (Lecture, 2009)
    • 3D Integration technology: Status and application development 

      Ramm, Peter; Klumpp, Armin; Weber, Josef; Lietaer, Nicolas; Taklo, Maaike M. Visser; de Raedt, W.; Fritzsch, Thomas; Couderc, Pascal (Journal article; Peer reviewed, 2010)
      As predicted by the ITRS roadmap, semiconductor industry development dominated by shrinking transistor gate dimensions alone will not be able to overcome the performance and cost problems of future IC fabrication. Today ...
    • 3D interconnect technologies for advanced MEMS/NEMS applications 

      Lietaer, Nicolas; Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Lecture, 2009)
    • 3D stacked MEMS and ICs in a miniaturized sensor node 

      Lietaer, Nicolas (Lecture, 2009)
      Solutions for through silicon viasSolutions for interconnectsDemonstrator for e-CUBES
    • 3D stacked MEMS and ICs in a miniaturized sensor node 

      Lietaer, Nicolas (Chapter, 2009)
      3D integration of micro electromechanical systems (MEMS) is expected to reduce the foot print of existing MEMS products and enable production of miniaturized sensor nodes on a large scale. However, 3D integration of MEMS ...
    • Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for the Super-LHC 

      Koybasi, Ozhan; Bortoletto, Daniela; Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand; Bolla, Gino; Kwan, Simon Wing Lok (Journal article; Peer reviewed, 2010)
    • Development and fabrication of full 3D-sensors at SINTEF MiNaLab 

      Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand (Lecture, 2009)
    • Electrical Characterization and Preliminary Beam Test Results of 3D Silicon CMS Pixel Detectors 

      Koybasi, Ozhan; Alagoz, Enver; Krzywda, Alex; Arndt, Kirk; Bolla, Gina; Bortoletto, Daniela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Kok, Angela Chun Ying; Kwan, Simon; Lietaer, Nicolas; Rivera, Ryan; Shipsey, Ian; Uplegger, Lorenzo; Da Via, Cinzia (Journal article; Peer reviewed, 2011)
      The fabrication of 3D detectors which requires bulk micromachining of columnar electrodes has been realized with advancements in MEMS technology. Since the fabrication of the first 3D prototype in Stanford Nanofabrication ...
    • Etching buried oxide at the bottom of high aspect ratio structures 

      Summanwar, Anand; Lietaer, Nicolas (Lecture, 2011)
      Plasma based dry etching is a key process widely used in micro-fabrication today. In this article, we look at the challenges involved in the anisotropic etching of buried SiO2 layers at the bottom of high aspect ratio ...
    • Etching Burried Oxide at the Bottom of High Aspect Ratio Structures 

      Summanwar, Anand; Lietaer, Nicolas (Chapter, 2011)
      Plasma based dry etching is a key process widely used in micro-fabrication today. In this article, we look at the challenges involved in the anisotropic etching of buried SiO2 layers at the bottom of high aspect ratio ...
    • High aspect ratio deep RIE for novel 3D radiation sensors in high energy physics applications 

      Kok, Angela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Lietaer, Nicolas; Mielnik, Michal Marek; Storås, Preben (Journal article; Peer reviewed, 2009)
      3D detectors with electrodes penetrating through the entire silicon substrate have many advantages over conventional planar silicon technology, for example, high radiation tolerance. High aspect ratio through-wafer holes ...
    • (Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications 

      Lietaer, Nicolas; Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Ramm, Peter (Journal article; Peer reviewed, 2010)
      3D integration and wafer level packaging (WLP) with through-silicon vias offer benefits like reduced footprint and improved performance. CMOS imaging sensors is one of the first successful introductions of a product with ...
    • Latest Results From 2nd SINTEF 3D-Run 

      Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand (Lecture, 2009)
    • MEMS Sensor/IC Integration for Miniaturized TPMS (e-CUBES) 

      Lietaer, Nicolas (Lecture, 2008)
      Sensor networks are researched in various automotive applications, in particular in tirepressure monitoring systems (TPMS) installed as autonomous sensor nodes. A tire-mounted TPMS should ideally weight less than 5 grams ...
    • Next lot of 3-D detectors at SINTEF 

      Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Mielnik, Michal Marek; storås, Preben; Jensen, Geir Uri (Lecture, 2009)
    • Technologies enabling 3D stacking of MEMS 

      Taklo, Maaike Margrete Visser; Mielnik, Michal Marek; Schjølberg-Henriksen, Kari; Storås, Preben; Tofteberg, Hannah Rosquist; Lietaer, Nicolas; Johannessen, Rolf (Chapter, 2010)
    • The SiRi particle-telescope system 

      Guttormsen, Magne Sveen; Bürger, Alexander; Hansen, Thor-Erik; Lietaer, Nicolas (Journal article; Peer reviewed, 2011)
      A silicon particle-telescope system for light-ion nuclear reactions is described. In particular, the system is optimized for level density and γ‐ray strength function measurements with the so-called Oslo method. Eight ...
    • TSV development for miniaturized MEMS acceleration switch 

      Lietaer, Nicolas; Summanwar, Anand; Dalsjø, Per G.; Bakke, Thor; Tofteberg, Hannah Rosquist (Lecture, 2010)
      Fragile micromachined MEMS structures are usually protected by bonding a capping wafer to the device wafer itself. As opposed to using lateral interconnects at the interface between the cap wafer and the device wafer, the ...
    • TSV development for miniaturized MEMS acceleration switch 

      Lietaer, Nicolas; Summanwar, Anand; Bakke, Thor; Taklo, Maaike Margrete Visser; Dalsjø, Per G. (Chapter, 2011)
      Fragile micromachined MEMS structures are usually protected by bonding a capping wafer to the device wafer itself. As opposed to using lateral interconnects at the interface between the cap wafer and the device wafer, the ...
    • Wafer-level packaged MEMS switch with TSV 

      Lietaer, Nicolas; Bakke, Thor; Summanwar, Anand; Dalsjø, Per G.; Gakkestad, Jakob; Niklaus, Frank (Lecture, 2011)