• Al-Al thermocompression bonding for wafer-level MEMS sealing 

      Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2014)
      Al–Al thermocompression bonding has been studied using test structures relevant for wafer level sealing of MEMS devices. Si wafers with protruding frame structures were bonded to planar Si wafers, both covered with a ...
    • Al-Al Wafer-Level Thermocompression Bonding applied for MEMS 

      Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje (Chapter, 2017)
      Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are ...
    • Enhancement of thermoelectric properties by energy filtering: Theoretical potential and experimental reality in nanostructured ZnSb 

      Berland, Kristian; Song, Xin; Carvalho, Patricia; Persson, Clas; Finstad, Terje; Løvvik, Ole Martin (Journal article; Peer reviewed, 2016)
      Energy filtering has been suggested by many authors as a means to improve thermoelectric properties. The idea is to filter away low-energy charge carriers in order to increase Seebeck coefficient without compromising ...
    • Enhancement of thermoelectric properties by energy filtering: Theoretical potential and experimental reality in nanostructured ZnSb 

      Berland, Kristian; Song, Xin; Carvalho, Patricia; Persson, Clas; Finstad, Terje; Løvvik, Ole Martin (Journal article; Peer reviewed, 2016)
      Energy filtering has been suggested by many authors as a means to improve thermoelectric properties. The idea is to filter away low-energy charge carriers in order to increase Seebeck coefficient without compromising ...
    • Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity 

      Malik, Nishant; Poppe, Erik; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2015)
      Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying different bonding parameters have been investigated. Laminates of diameter 150 mm were realized by bonding wafers containing ...
    • Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity 

      Malik, Nishant; Tofteberg, Hannah Rosquist; Poppe, Erik; Finstad, Terje; Schjølberg-Henriksen, Kari (Journal article; Peer reviewed, 2015)
      Hermeticity, reliability and strength of four laminates bonded at different temperatures by Au-Au thermocompression bonding have been investigated. Laminates with a diameter of 150 mm were realized by bonding a wafer ...
    • Impact of SiO2 on Al–Al thermocompression wafer bonding 

      Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser; Finstad, Terje (Journal article; Peer reviewed, 2015)
      Al–Al thermocompression bonding suitable for wafer level sealing of MEMS devices has been investigated. This paper presents a comparison of thermocompression bonding of Al films deposited on Si with and without a thermal ...
    • Interfacial characterization of Al-Al thermocompression bonds 

      Malik, Nishant; Carvalho, Patricia; Poppe, Erik; Finstad, Terje (Journal article; Peer reviewed, 2016)
      Interfaces formed by Al-Al thermocompression bonding were studied by the transmission electron microscopy. Si wafer pairs having patterned bonding frames were bonded using Al films deposited on Si or SiO2 as intermediate ...
    • Oxygen nonstoichiometry in (Ca2CoO3)0.62(CoO2): a combined experimental and computational study 

      Schrade, Matthias; Casolo, Simone; Graham, Paul J.; Ulrich, Clemens; Li, Sean; Løvvik, Ole Martin; Finstad, Terje; Norby, Truls (Peer reviewed; Journal article, 2014)
      The oxygen nonstoichiometry in the misfit calcium cobaltite (Ca2CoO3)0.62(CoO2) has been studied experimentally and by density functional theory (DFT) calculations. The standard oxidation enthalpy ΔH0Ox of oxygen deficient ...
    • Shallow Impurity Band in ZrNiSn 

      Schrade, Matthias; Berland, Kristian; Kosinskiy, Andrey; Heremans, Joseph P.; Finstad, Terje (Peer reviewed; Journal article, 2020)
      ZrNiSn and related half Heusler compounds are candidate materials for efficient thermoelectric energy conversion with a reported thermoelectric figure-of-merit of n-type ZrNiSn exceeding unity. Progress on p-type materials ...
    • Texture of Al films for wafer-level thermocompression bonding 

      Malik, Nishant; Venkatachalapathy, Vishnukanthan; Dall, Wilhelm; Schjølberg-Henriksen, Kari; Poppe, Erik Utne; Taklo, Maaike M. Visser; Finstad, Terje (Journal article; Peer reviewed, 2017)
      Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were ...