Browsing SINTEF Open by Author "Aasmundtveit, Knut"

Now showing items 1-3 of 3

    • New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study 

      Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin (Chapter; Peer reviewed, 2019)
      Thermal management is important for medical ultrasound probes to maintain optimal performance, reliability, and lifetime of the devices, as well as to avoid heat-induced damage to the patients’ tissue. This paper presents ...

    • A Review of Eutectic Au-Ge Solder Joints 

      Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut (Journal article; Peer reviewed, 2019)
      Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. ...

    • Thermal management of an interventional medical device with double layer encapsulation 

      Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Aasmundtveit, Knut; Nguyen, Hoang-Vu; Imenes, Kristin (Peer reviewed; Journal article, 2021)
      This paper presents a thermal study of a double-layer encapsulation for an interventional medical device, which operates temporarily inside the human esophagus for cardiac imaging. The surface temperature of test samples, ...